One of the aspects of modern silicon technology is increasing demand for smaller particles to be removed from wafers. For smaller particles - at the nanoscale level - a stronger removal force should be applied. On the other hand, the stronger force damages useful structures on silicon substrates. So, the cleaning process becomes a magical art.

A Rapid Superheat Cleaning process could help both cleaning tools and chip makers to solve some tough technological problems at micro- and nanoscale levels: ...................................................................................... Read more... (pdf file)   "Parametric Nanoscale Cleaning", “Emerging Technologies in Semiconductor Surface Preparation” Conference SEMATECH, 25-26 of April, 2007, Austin, Texas, USA ...................................................................................... Read more... (PowerPoint)   ECS Transactions - Washington, DC Volume 11 at "Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10", Washington, D.C. Conference, October 11th , 2007, Electro Chemical Society (ECS). ...................................................................................... Read more... (pdf)